Wafer level packaging and flip chip design are the most recent trends in LED manufacturing and packaging. These LED types are perfectly suited for producing COB modules. This combination already promises better thermal performance than standard SMD package based products. However, there is still room for improvements. Pao Chen, Director of Research and Development at Flip Chip Opto shows how a 3-pad flip chip LED further reduces thermal resistance, allows higher power and can help to reduce costs.
3-Pad LED Flip Chip COB — LED professional - LED Lighting
Light-emitting diode - Wikipedia
3-Pad LED Flip Chip COB — LED professional - LED Lighting
The History of Fiber Optics - V1 Fiber, fiber optic
3-Pad LED Flip Chip COB — LED professional - LED Lighting
Light-emitting diode - Wikiwand
Light-emitting diode - Wikiwand
Light-emitting diode - Wikipedia
Light-emitting diode - Wikiwand
Light-emitting diode - Wikiwand
Light-emitting diode - Wikiwand
Light-emitting diode - Wikipedia
Light-emitting diode - Wikiwand
Light-emitting diode - Wikipedia
