COF (Chip on Flex) is a display packaging technology, where a chip is mounted directly to a flex circuit. Also refer to COG and COP.
PDF] Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
Schematics of the COF bonding process using ACFs.
COF technology, short for chip on film, is widely used in small and medium-sized displays.
PDF] Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
PDF) Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
Find all TI packages
-Foto-emulation-com.png)
chip on flex (CoF)
LB루셈
Flexible COF LED strips with integrated lens for outdoor applications
PDF) Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability
