The dummy Flip package carrier, either substrates or lead frame provides the connection from the die to the exterior of the package.
PDF] Comparisons of Interfacial Reaction Characteristics on Flip
Flip-Chip
Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10
Practical Components
Board level solder joint reliability analysis of stacked die mixed
Micromachines, Free Full-Text
Practical Dummy Components Daisy Chain Dummy Components
Micromachines, Free Full-Text
Topline Dummy Components
Thermal Stresses in a Flip-Chip Design, Background/Incentive
a) A typical flip-chip, CBGA package with heat sink (adapted from
Typical Packaging Architecture for a High Performance Flip Chip
Anxiously Awaiting TMV™ (Through Mold Via) PoP Dummy Components, Indium Corporation®, Indium Corporation Blogs, BGA, Flux, Indium Corporation, PoP Flux, Rework, SMT Solder
